Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
New York: Wiley-Interscience, (1994). First Edition, Second Printing. Hardcover. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket. Near Fine / Near Fine. Item #545
ISBN: 0471594466
Price: $57.00 CAD other currencies
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